ADP is applicable to both thermoplastic and thermosetting resins, with particular suitability for epoxy resin printed circuit boards requiring stringent flame-retardant performance, including FR-4 and CEM-3.

Using high-shear mixing equipment, ADP can be readily dispersed in epoxy resin. At an addition level of 30 parts ADP per 100 parts resin, the resulting product can achieve a UL 94 V-0 flame-retardant rating. ADP can also be used synergistically with other flame retardants, such as ATH.

The above information is for reference. Actual formulations, processing conditions and test results should be verified according to the specific resin system and product requirements.